Buffer overflow in Qualcomm Mdm9607
CVE-2019-2312
When handling the vendor command there exists a potential buffer overflow due to lack of input validation of data buffer received in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9607, MDM9640, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM630, SDM660, SDX24
Vulnerability class: Buffer Overflow
EPSS: 0.002 (9.7th percentile) — read the EPSS interpretation.
CVSS v3 metric
CVSS v3 base score 7.8 (High). Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H.
Affected products
Weakness classification (CWE)
Public proof-of-concept exploits
References
- product-security@qualcomm.com (x_refsource_CONFIRM, Patch, Third Party Advisory)
Frequently asked questions
- What is CVE-2019-2312?
- CVE-2019-2312 is a high-severity vulnerability in Qualcomm Mdm9607, classified under Improper Restriction of Operations within the Bounds of a Memory Buffer. CVSS score: 7.8/10. Published 2019-07-25.
- How severe is CVE-2019-2312?
- High severity. CVSS v3 base score is 7.8 out of 10.
- Is CVE-2019-2312 known to be exploited?
- 1 public proof-of-concept repositories are indexed. Not currently listed in the CISA KEV catalog.