Use After Free in Qualcomm Apq8009
CVE-2019-14037
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Vulnerability class: Use-After-Free
EPSS: 0.002 (10.0th percentile) — read the EPSS interpretation.
CVSS v3 metric
CVSS v3 base score 7.8 (High). Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H.
Affected products
Weakness classification (CWE)
References
- product-security@qualcomm.com (x_refsource_CONFIRM, Broken Link)
- nvd@nist.gov (Patch, Vendor Advisory)
Frequently asked questions
- What is CVE-2019-14037?
- CVE-2019-14037 is a high-severity vulnerability in Qualcomm Apq8009, classified under Use After Free. CVSS score: 7.8/10. Published 2020-07-30.
- How severe is CVE-2019-14037?
- High severity. CVSS v3 base score is 7.8 out of 10.