Buffer overflow in Qualcomm Mdm9607

CVE-2019-10606

Out-of-bound access will occur in USB driver due to lack of check to validate the frame size passed by user in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9607, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, QCS605, SDX24

Vulnerability class: Buffer Overflow

Published · last modified .

CVSS v3 metric

CVSS v3 base score 7.8 (High). Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H.

EPSS exploit prediction

EPSS: 0.002 (9.1th percentile), scored .

Very low probability of exploitation in the next 30 days; routine patching cadence is appropriate. 9th percentile — 9.1% of CVEs in the catalogue have a lower EPSS than this one. How to read EPSS.

EPSS trend (30 days)EPSS over the last 30 days for CVE-2019-10606: held from 0.002 to 0.002.

EPSS over last 30 days · oldest: 0.002 · newest: 0.002 · change: 0.000

Affected products

Weakness classification (CWE)

References

Frequently asked questions

What is CVE-2019-10606?
CVE-2019-10606 is a high-severity vulnerability in Qualcomm Mdm9607, classified under Buffer Copy without Checking Size of Input (Classic Buffer Overflow). CVSS score: 7.8/10. Published 2020-01-21.
How severe is CVE-2019-10606?
High severity. CVSS v3 base score is 7.8 out of 10.