Buffer overflow in Qualcomm Mdm9607
CVE-2019-10606
Out-of-bound access will occur in USB driver due to lack of check to validate the frame size passed by user in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9607, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, QCS605, SDX24
Vulnerability class: Buffer Overflow
EPSS: 0.002 (10.5th percentile) — read the EPSS interpretation.
CVSS v3 metric
CVSS v3 base score 7.8 (High). Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H.
Affected products
Weakness classification (CWE)
References
- product-security@qualcomm.com (x_refsource_CONFIRM, Patch, Vendor Advisory)
Frequently asked questions
- What is CVE-2019-10606?
- CVE-2019-10606 is a high-severity vulnerability in Qualcomm Mdm9607, classified under Buffer Copy without Checking Size of Input (Classic Buffer Overflow). CVSS score: 7.8/10. Published 2020-01-21.
- How severe is CVE-2019-10606?
- High severity. CVSS v3 base score is 7.8 out of 10.