Buffer overflow in Qualcomm Mdm9206
CVE-2018-13888
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
Vulnerability class: Buffer Overflow
EPSS: 0.002 (14.2th percentile) — read the EPSS interpretation.
CVSS v3 metric
CVSS v3 base score 7.8 (High). Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H.
Affected products
Weakness classification (CWE)
References
- product-security@qualcomm.com (Third Party Advisory, vdb-entry, x_refsource_BID)
- product-security@qualcomm.com (x_refsource_CONFIRM, Vendor Advisory)
Frequently asked questions
- What is CVE-2018-13888?
- CVE-2018-13888 is a high-severity vulnerability in Qualcomm Mdm9206, classified under Improper Restriction of Operations within the Bounds of a Memory Buffer. CVSS score: 7.8/10. Published 2019-02-11.
- How severe is CVE-2018-13888?
- High severity. CVSS v3 base score is 7.8 out of 10.