Buffer overflow in Qualcomm Mdm9206
CVE-2018-11264
Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.
Vulnerability class: Buffer Overflow
EPSS: 0.002 (15.4th percentile) — read the EPSS interpretation.
CVSS v3 metric
CVSS v3 base score 7.8 (High). Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H.
Affected products
Weakness classification (CWE)
References
- product-security@qualcomm.com (x_refsource_CONFIRM, Vendor Advisory)
- product-security@qualcomm.com (VDB Entry, Third Party Advisory, vdb-entry, x_refsource_BID)
Frequently asked questions
- What is CVE-2018-11264?
- CVE-2018-11264 is a high-severity vulnerability in Qualcomm Mdm9206, classified under Improper Restriction of Operations within the Bounds of a Memory Buffer. CVSS score: 7.8/10. Published 2018-11-28.
- How severe is CVE-2018-11264?
- High severity. CVSS v3 base score is 7.8 out of 10.