Vulnerability in Qualcomm Mdm9206
CVE-2017-18323
Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.
EPSS: 0.002 (11.4th percentile) — read the EPSS interpretation.
CVSS v3 metric
CVSS v3 base score 5.5 (Medium). Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N.
Affected products
Weakness classification (CWE)
References
- product-security@qualcomm.com (x_refsource_CONFIRM, Vendor Advisory)
- product-security@qualcomm.com (VDB Entry, Third Party Advisory, vdb-entry, x_refsource_BID)
Frequently asked questions
- What is CVE-2017-18323?
- CVE-2017-18323 is a medium-severity vulnerability in Qualcomm Mdm9206, classified under CWE-320. CVSS score: 5.5/10. Published 2019-01-03.
- How severe is CVE-2017-18323?
- Medium severity. CVSS v3 base score is 5.5 out of 10.