Vulnerability in Qualcomm Sd 845
CVE-2017-18309
A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850.
EPSS: 0.002 (14.9th percentile) — read the EPSS interpretation.
CVSS v3 metric
CVSS v3 base score 7.1 (High). Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N.
Affected products
Weakness classification (CWE)
Public proof-of-concept exploits
References
- product-security@qualcomm.com (x_refsource_CONFIRM, Vendor Advisory)
- product-security@qualcomm.com (VDB Entry, Third Party Advisory, vdb-entry, x_refsource_SECTRACK)
Frequently asked questions
- What is CVE-2017-18309?
- CVE-2017-18309 is a high-severity vulnerability in Qualcomm Sd 845, classified under Improper Validation of Array Index. CVSS score: 7.1/10. Published 2018-10-26.
- How severe is CVE-2017-18309?
- High severity. CVSS v3 base score is 7.1 out of 10.
- Is CVE-2017-18309 known to be exploited?
- 1 public proof-of-concept repositories are indexed. Not currently listed in the CISA KEV catalog.