Vulnerability in Qualcomm Sd 845
CVE-2017-18309
A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850.
Published · last modified .
CVSS v3 metric
CVSS v3 base score 7.1 (High). Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N.
EPSS exploit prediction
EPSS: 0.002 (13.3th percentile), scored .
Very low probability of exploitation in the next 30 days; routine patching cadence is appropriate. 13th percentile — 13.3% of CVEs in the catalogue have a lower EPSS than this one. How to read EPSS.
EPSS over last 30 days · oldest: 0.002 · newest: 0.002 · change: 0.000
Affected products
Weakness classification (CWE)
Public proof-of-concept exploits
References
- www.qualcomm.com/company/product-security/bulletins (Vendor Advisory)
- www.securitytracker.com/id/1041432 (VDB Entry, Third Party Advisory, vdb-entry)
Frequently asked questions
- What is CVE-2017-18309?
- CVE-2017-18309 is a high-severity vulnerability in Qualcomm Sd 845, classified under Improper Validation of Array Index. CVSS score: 7.1/10. Published 2018-10-26.
- How severe is CVE-2017-18309?
- High severity. CVSS v3 base score is 7.1 out of 10.
- Is CVE-2017-18309 known to be exploited?
- 1 public proof-of-concept repositories are indexed. Not currently listed in the CISA KEV catalog.