What is CVE-2017-18173?

CVE-2017-18173 is a high-severity vulnerability in Qualcomm Sd 425, classified under Integer Overflow or Wraparound. CVSS score: 7.8/10. Published 2019-05-06.

How severe is CVE-2017-18173?

High severity. CVSS v3 base score is 7.8 out of 10.

Is CVE-2017-18173 known to be exploited?

1 public proof-of-concept repositories are indexed. Not currently listed in the CISA KEV catalog.

Integer overflow in Qualcomm Sd 425

CVE-2017-18173

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

Vulnerability class: Integer Overflow

EPSS: 0.002 (13.6th percentile) — read the EPSS interpretation.

CVSS v3 metric

CVSS v3 base score 7.8 (High). Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H.

Affected products

Weakness classification (CWE)

CWE-190 — Integer Overflow or Wraparound

Public proof-of-concept exploits

ARPSyndicate/cvemon

References

product-security@qualcomm.com (x_refsource_MISC, Vendor Advisory)

Frequently asked questions

What is CVE-2017-18173?: CVE-2017-18173 is a high-severity vulnerability in Qualcomm Sd 425, classified under Integer Overflow or Wraparound. CVSS score: 7.8/10. Published 2019-05-06.
How severe is CVE-2017-18173?: High severity. CVSS v3 base score is 7.8 out of 10.
Is CVE-2017-18173 known to be exploited?: 1 public proof-of-concept repositories are indexed. Not currently listed in the CISA KEV catalog.