What is CVE-2017-18157?

CVE-2017-18157 is a high-severity vulnerability in Qualcomm Mdm9206, classified under Use After Free. CVSS score: 7.8/10. Published 2019-05-06.

How severe is CVE-2017-18157?

High severity. CVSS v3 base score is 7.8 out of 10.

Is CVE-2017-18157 known to be exploited?

1 public proof-of-concept repositories are indexed. Not currently listed in the CISA KEV catalog.

Use After Free in Qualcomm Mdm9206

CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Vulnerability class: Use-After-Free

EPSS: 0.002 (15.6th percentile) — read the EPSS interpretation.

CVSS v3 metric

CVSS v3 base score 7.8 (High). Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H.

Affected products

Weakness classification (CWE)

CWE-416 — Use After Free

Public proof-of-concept exploits

ARPSyndicate/cvemon

References

product-security@qualcomm.com (x_refsource_CONFIRM, Vendor Advisory)

Frequently asked questions

What is CVE-2017-18157?: CVE-2017-18157 is a high-severity vulnerability in Qualcomm Mdm9206, classified under Use After Free. CVSS score: 7.8/10. Published 2019-05-06.
How severe is CVE-2017-18157?: High severity. CVSS v3 base score is 7.8 out of 10.
Is CVE-2017-18157 known to be exploited?: 1 public proof-of-concept repositories are indexed. Not currently listed in the CISA KEV catalog.