Use After Free in Qualcomm Mdm9206
CVE-2017-18140
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.
Vulnerability class: Use-After-Free
EPSS: 0.013 (68.0th percentile) — read the EPSS interpretation.
CVSS v3 metric
CVSS v3 base score 9.8 (Critical). Vector: CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H.
Affected products
Weakness classification (CWE)
Public proof-of-concept exploits
References
- product-security@qualcomm.com (x_refsource_CONFIRM, Vendor Advisory)
- product-security@qualcomm.com (VDB Entry, Third Party Advisory, vdb-entry, x_refsource_BID)
Frequently asked questions
- What is CVE-2017-18140?
- CVE-2017-18140 is a critical-severity vulnerability in Qualcomm Mdm9206, classified under Use After Free. CVSS score: 9.8/10. Published 2018-04-11.
- How severe is CVE-2017-18140?
- Critical severity. CVSS v3 base score is 9.8 out of 10.
- Is CVE-2017-18140 known to be exploited?
- 1 public proof-of-concept repositories are indexed. Not currently listed in the CISA KEV catalog.